1.The integrated hot air head and placement head design enables automatic placement, soldering, and removal.
2.The upper head utilizes a hot air system for rapid, uniform heating and rapid cooling (with a temperature drop of 50-80°C), meeting the requirements of lead-free soldering. The lower heating zone utilizes a combination of infrared and hot air heating. Infrared radiation directly impacts the heating area, simultaneously conducting heat with the hot air. This compensates for each other's shortcomings, allowing for rapid PCB heating (up to 10°C/s) while maintaining uniform temperature.
3.Three independent heating zones (upper, lower, and infrared preheating) are designed. The upper and lower zones automatically move synchronously, allowing them to reach any position within the bottom infrared preheating zone. The lower zone moves up and down to support the PCB, controlled by a motor. PCB
4.Without moving on the fixture, the upper and lower heating heads move in unison to the target chip on the PCB.
5.The PCB card utilizes high-precision sliders to ensure BGA and PCB placement accuracy.
6.The unique bottom preheating platform utilizes premium heating materials imported from Germany (infrared gold-plated light tubes) and anti-glare constant-temperature glass (temperature resistant up to 1800°C), providing a preheating area of 500 x 420 mm. Advantages of the infrared light tubes: Rapid heating. During normal heating, the temperature difference between the PCB surrounding area and the reworked chip is minimal, preventing deformation or distortion of the PCB, thereby improving chip soldering yield.
7.The preheating platform, clamping plate, and cooling system are fully movable in the X-axis. Makes PCB positioning and soldering safer and more convenient.
8.Motor-controlled X and Y movement makes alignment quick and easy, fully utilizing the machine space. With a relatively small footprint, it can rework large PCBs, with a maximum clamping plate size of 610*480mm, eliminating dead angles.
9.Dual joystick control, alignment lens, and upper and lower heating platforms ensure accurate alignment.
10.Built-in vacuum pump, φ-angle rotation, and precise nozzle adjustment for placement.
11.The nozzle automatically detects material pickup and placement height, and pressure can be controlled within a narrow range of 10 grams, providing zero-pressure pickup and placement capabilities for smaller chips.
12.The color optical vision system features manual X and Y movement, dual-color spectroscopic, magnification, and fine-tuning functions, including a color difference resolution device, autofocus, and software-controlled functions. It can rework BGAs up to 80*80mm.
13.Various sizes of alloy hot air nozzles are easily replaceable and can be rotated 360°.
14.5 The machine features a temperature measurement port, enabling real-time multi-point temperature monitoring and analysis.
15.A solid-state operating display ensures safe and reliable temperature control.
16.The machine automatically generates standard SMT temperature removal curves for different regions and ambient temperatures, eliminating the need for manual machine curve setup. Experienced and inexperienced operators can use the machine intelligently.
17.A camera capable of observing the melting point of solder balls facilitates curve determination (optional).
 

is_customized ：No
Model Number：WDS-820A
Brand Name:WDS
Origin Mainland China
Certification:CE
5 Thermocouples 
5 Temp Sensors
Full Automatic, 
Motorized X/Y, 
5 Thermocouples, 
10g Pressure Control, 
2-50x Magnification